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Substare process - Coggle Diagram

- - - - 目的
        
        建立不同 Layer 之間的電氣連接。
        
        Via
        
        layer 1 --> via --> layer 2
        
        訊號在不同樓層之間移動的電梯
        
        Mechanical Drill
        
        傳統較大孔徑
        
        Laser Drill
        
        Microvia
        
        高階 ABF 載板
      - Desmear
        
        清除孔壁殘膠(Resin)
        
        讓後續鍍銅品質穩定
        
        Copper Plating
        
        目的
        
        鍍銅讓 Via 孔壁產生導電能力
        
        流程
        
        Electroless Copper
        
        Electroplating
        
        Photolithography & Pattern Formation
        
        直接決定：Routing Capability。
        
        塗覆 Photoresist (光阻)
        
        Exposure (曝光)
        
        Develop
        
        1 more item...
        
        Etching (蝕刻)
        
        Copper Trace (銅線軌跡)
        
        真正的電路
        
        Build-up Process
        
        ABF Substrate 的核心
        
        1 more item...
        
        每增加一層 Routing
        
        1 more item...
        
        As chip I/O continues to increase, especially for AI and HBM applications, substrate suppliers must support higher routing density through finer line and space, smaller microvias, and increased layer counts.
        
        1 more item...
        
        Solder Mask
        
        2 more items...
        
        Finer width and space
        
        Line Space (線距)
        
        Line Width (線寬)
        
        Line/Space 越細
        
        3 more items...
  - - - Copper
      - 組成
        
        Glass Fiber
        
        Resin 樹脂
        
        Copper Foil
  - - - 會在後續 Build-up 過程加入 ABF film