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Unit 45: Typical Materials - Coggle Diagram
Unit 45: Typical Materials
Polymers
Polylactic acid (PLA)
PROPERTIES: lower melting point than many petrochemical plastics and requires less energy for conversion. Because of its low melting point, cheap, easy to print, and smokeless characteristics. PLA has become the best choice for 3D printing.
AM : Material Extrusion
Polyamides
PROPERTIES: Polyamides are among the most important and useful technical thermoplastics due to their outstanding wear resistance, good coefficient of friction, and very good temperature and impact properties.
AM: Laser Sintering
Acrylonitrile Butadiene Styrene (ABS)
PROPERTIES:a low melting point, which enables its easy use in the injection moulding process and 3D printing. It also has high tensile strength and is very resistant to physical impacts and chemical corrosion,
AM : Material Jetting
Metals
Titanium (Ti)
PROPERTIES: strong, lustrous, corrosion-resistant
AM: Powder Bed Fusion
Aluminium (Al)
PROPERTIES: lightweight,ductile,malleable,electrical and thermal conductor
AM: Selective Laser Melting
Steel
PROPERTIES: hardness, toughness, tensile strength, yield strength, elongation, fatigue strength, corrosion, plasticity, malleability and creep.
AM: Powder Bed Fusion
Gold
PROPERTIES: one of the densest of all metals. It is a good conductor of heat and electricity. It is also soft and the most malleable
AM:DMLS (Direct Metal Laser Sintering) or SLM process
Silver
PROPERTIES :lustrous, soft, very ductile, malleable, it is an excellent conductor of heat and electricity
AM: Powder Bed Fusion
Composites
Glass fillers within polymers
PROPERTIE: improved mechanical properties of rigidity, strength and may also have improved surface hardness.
AM: Photo Polymerization
Cermets
PROPERTIES:high temperature resistance and hardness
AM:Laser melting
Carbon fibre
PROPERTIES: high mechanical strength, high stiffness, lightweight, very low thermal expansion, and superior chemical resistance.
AM:The Carbon DLS™ Process
Epoxy resins
PROPERTIES:strong-properties of the epoxy allow for structural and engineering adhesives
AM: Photo Polymerization
