Small Outline Integrated Circuit (SOIC)

Through-Hole Package

Surface-Mount Package

Ball Grid Array (BGA)

Embedded Wafer Level Ball Grid Array (EWLB)

Quad Flat Package (QFP)

Dual in-Line Package (DIP)

Plastic Leaded Chip Carrier (PLCC)

Flip-Chip Package

Wafer-level package (WLP)

Stacked Packages

Fan-Out Wafer-Level Packaging (FOWLP)

System-On-Package (SOP)

Package-In-Package (PIP)

System-In-Package (SIP)

Multi-Chip Module (MCM)

Chip-On-Board (COB)

Package-On-Package (POP)

3D Packaging

Flat Type Package

Others

Ceramic Package

Plastic Package

Metal Package

Copper Pillar

Wire Bonding

Others

Redistribution Layer (RDL)

Flip-Chip Interconnect

Through-Silicon Via (TSV)

Others