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Semiconductor Industry, Upstream, G4 (111212005 IBS3 Ruby 楊絜茹, 110251037…

- - - - IC Manufacturing & Wafer Production
        
        Prints circuit patterns on wafers, producing integrated circuits through multiple processes.
        
        Support Industries
        
        equipment, photomasks, chemicals
      - Downstream
        
        IC Packaging and Testing
        
        IC Modules
        
        Combine multiple ICs into functional modules.
        
        IC Distribution
        
        Handles IC procurement and sales to downstream electronics manufacturers
        
        Cut wafers into dies, encapsulate them for protection and connectivity
        
        Testing Equipment & Components
        
        Materials like substrates and lead frames
        
        ASE Technology
        
        SPIL
- - - - 62%
        
        2024Q2
      - 2024Q3
  - - - 15.27%
        
        16.37%
        
        2022
        
        18％
        
        2023
        
        2021
      - 2020
- - - - including design and verification
- - - - Competitive advantage
        
        Known for cost-effective design
        
        Design Services works closely with TSMC and UMC
        
        Industry alliance
        
        Future prospects
        
        MediaTek continues to make efforts in the fields of 5G and IoT
        
        Actively participate in the development and market expansion of high-end technologies
      - :checkered_flag:A leader in Taiwan’s IC design field
        
        Ranked 5th globally
    - - Jointly promote industrial innovation
        
        Benefit from
        
        Collective investment
        
        To keep Taiwan at the forefront of competition in the global electronics industry
        
        Knowledge sharing
      - Challenge integrated equipment manufacturers
  - - - Focusing on Specific Market Niches
        
        mobile phone chips
        
        particularly in developing markets
        
        affordable yet feature-rich solutions
        
        VS Qualcomm high-end, fast chips
    - - Offering "Turnkey" Solutions
        
        tailored for specific device
        
        +
        
        high-quality
        
        cost-effective
        
        touchscreens
        
        5G connectivity
        
        premium cameras
        
        thoroughly tested software
        
        SDKs and technical training
        
        help customers customize the designs
        
        modify
        
        directly brand and sell
    - - Entering Emerging Markets
        
        entering mature market
        
        offering competitive prices and features
        
        Ex.
        
        2001 researching mobile phone market
        
        2004 capturing 14% of Global market share
    - - Building Close Partnerships with Customers
        
        understand their needs and deliver tailored solutions
        
        4 SIM card slots for Brazilian clients
    - - Continuous Innovation
        
        Dimensity 9400
        
        TSMC's 2nd gen 3nm process
        
        innovative full-core CPU architecture
        
        Agentic AI capabilities
        
        stunning ray tracing graphics effects
        
        high-quality professional images
        
        outstanding wireless communication technology
        
        supporting foldable screen
    - - Expanding Application-Specific IC Business
        
        revenue starting in the second half of 2025
        
        2.5D packaging solutions (InFO, Interposer, CoWoS)
        
        Multi-chip packaging (MCM)
        
        High-power power supply design with efficient heat treatment function
        
        large-scale high-speed chip design
    - - Investing in Employee AI Literacy
        
        generative AI service
        
        MediaTek DaVinci ("Liánfākē jì dá gē")
        
        AI training programs
- - - - Recession in the Taiwanese economy
        
        Difficulty selling its own chip designs
    - - The breakup of AT&T in the U.S.
        
        Allowing UMC to increase production and make a significant profit
    - - Robert Tsao, proposed creating a foundry for external customers
        
        Taiwanese government rejected it, fearing monopoly concerns
    - - Founded in 1980
  - - - From an Integrated Device Manufacturer (IDM) to a pure foundry model
        
        Focusing on contract manufacturing for external clients, e.g. MediaTek
    - - Current Position
        
        Third-largest foundry globally, after TSMC and Samsung (2021)
        
        Samsung: 17.3%
        
        UMC: 7.3%
        
        TSMC: 52.9%
      - Focus Areas
        
        Expanding its production capacity and improving technology for growing markets
- - - - UMC chose the "Gate-first" process, while TSMC adopted "Gate-last."
        
        Gate-last technology proved superior
        
        Smaller, faster, and more efficient chips
    - - Early rejection of the foundry model limited its early growth
    - - Dedicated foundry model, pioneered by TSMC in 1987
        
        Strong relationships with major international customers and perceived government support
    - - UMC setback
        
        In 1997, UMC partnered with IBM and Infineon to develop its 130-nanometer node
        
        TSMC successfully developed its own copper interconnect technology
  - - - The rise of Chinese foundries, especially SMIC, poses a new competitive threat to UMC.