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Pros Tech, In EMI (ElectroMagnetic Shielding), Thermal management, In SMT…
Pros Tech
Materials
ADHESIVES
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PCBA protection: coating, potting, LPM (resin particles), sealing, encapsulant
Thermal management (TMI - thermal interface material): thermal grease (no polymerization), adhesive for thermal, thermal gap filler, phase change materials
CA (Cyanoacrylate), ANA (Anaerobic): bonding; ANA for metal
UV adhesive: has all the adhesive bases, it's application in coating, bonding
PUR: polyurethane reactive, 1K
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Cleaning substances
Flux removal, activator removal, NOVEC
Primer, promoter, activator, accelerator
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