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4G/5G Circuits and Materials - (2/2) - Coggle Diagram
4G/5G Circuits and Materials - (2/2)
Multimode modem
Dynamic spectrum sharing (DSS)
Time division duplex (TDD)
Frequency division duplex (FDD)
Non-standalone (NSA)
Isolator
Magnetic material
Microprocessor
Microcontroller
Signal booster
Solar panel
Battery
Digital Interference
Cancellation System (ICS)
Isolation board
Metallic material
Radiation absorbing material
Clock
Cable/Coaxial cable
Multimode Fiber (MMF)
Heat-conducting powder
Liquid silicone rubber base glue
Foaming agent
Teflon
Auxiliary agent
Single-mode Fiber (SMF)
Sealing material
Microwave circuit
Ceramic materials
Dielectric
resonator modules
Oscillator module
Ultra/ super
conducting materials
Wireless charger
Boron Niobium
Iron-based micro /
nano magnetic powder material
Silicon (Si)
Molybdenum (Mo)
Nickel (Ni)
Copper (Cu)
RFIC
LTE signal processing circuit
NR signal processing circuit
Gallium Nitride (GaN)
Purified silica sol
Boron Carbide (B4C)
Circuit board
Glass
Polyphenol Ether (PPE)
Modified epoxy
Liquid crystal polymers (LCP)
Polytetrafluoroethylene (PTFE)
Alkali-free glass fiber base cloth
Polyimides (PI)
Low Temperature Co-fired Ceramics (LTCC)
Phenolic resins (PF)
Polyether Ether Ketone (PEEK)
Capacitor
Tantalum (Ta)
Aluminium (Al)
Multi-layer ceramic
Other components
Ferrite materials
Spin-ferrite materials
Vanadium oxide (V₂O₅)
Gadolinium oxide (Gd₂O₃)
Cupric oxide (CuO)
Ferric oxide (Fe2O3)
Bismuth tetroxide (BiO4-8)
Calcium carbonate (CaCO₃)
Indium oxide (In₂O₃)
Heat dissipation material
Zinc plating
Pre-cured liquid gel
Thermal gel
Thermal GAP PAD
Tin
Thermally Conductive Adhesives
Thermal interface coatings
Thermal grease
Thermal tapes
Thermal gap fillers
Thermally conductive hardware (TCH)
Graphite pads
Phase change materials (PCMs)
Thermally conductive epoxy adhesives
Silicone adhesives
Polyurethane resins (PU)
Baseband/base station
Base station brick
Phosphogypsum (PG)
Coal residue
Gallium Nitride (GaN)
Desulfurization gypsum
Quartz sand
Clay