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Lithography, 캡처_2021_12_07_21_14_53_766 - Coggle Diagram
Lithography
lithography
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lift-off process
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장점
back etching에 비해 step이 하나 줄어들어
공정 속도가 빠르고, etch가 어려운 금속을 이용 가능
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※process※
surface preparation→coating(spin casting)
→pre-bake(soft bake)
→alignment→exposure→development
→post-bake(hard bake)→processing using the photoresist as a making film→stripping→post processing cleaning(ashinh)
spin coating process
wafer cleaning
먼지, CMP particles, PR 잔여물등 제거
wafer primer
Si, GaAs를 이용하여 PR이 잘되게 사전작업한다
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