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Unit14: Typical materials - Coggle Diagram
Unit14: Typical materials
Metals
Steel
High strength, low weight, durable , ductile and corrosion resistance
Wire deposition and powder bed fusion uses steel
Gold (Au)
Properties
Melting point 1,063 °C
Boiling point2,966 °C
Most soft and malleable element
ductile
high corrosion resistance
Vey good heat and height conductivity
Gold is used in wire deposition processes such as direct metal laser sintering
Aluminum (Al)
Properties
Lightweight
high ductility
High malleability
Good electrical and thermal conductor
corrosive resistance (self protecting oxide layer)
Melting point 660 °C
Boiling point 2470 °C
Wire deposition and powder bed fusion uses aluminium
Titanium (Ti)
Properties,
Melting point=1650-1670 °C
Boiling point=3287 °C
It is ductile and has low electrical and thermal conductivity and it has good corrosion resistance
Wire deposition and powder bed fusion uses titanium
Silver (Ag)
Properties
melting point 960.8 °C
boiling point 2,212 °C
Soft
very ductile
malleable
excellent conductor of heat and electricity
Highest electrical conductivity
Silver is used in wire deposition processes such as direct metal laser sintering
Polymers
polylactic acid
Properties
Melting point between 130 °C-180 °C
ABS plastic is used in material extrusion, the name of the process is fused deposition modelling
polyamides
properties
High abrasion resistance
very tough
High tensile strength
high flexibility
average melting point 190°C
average boiling point 250°C
Selective laser sintering
Multi Jet Fusion
fused deposition modelling
Acrylonitrile Butadiene Styrene
Properties
high rigidity
good impact resistance
Good insulator
strong durable
Boiling point 145.2 °C
Melting point 200°C
ABS plastic is used in material extrusion, the name of the process is fused deposition modelling
Composites
cermet
properties
High temperature resistance
very hard
can undergo plastic deformation
increased wear and corrosion resistance
processes include binder jetting, direct laser deposition, selective laser melting
Carbon fibre
High strength, toughness
lightweight
good vibration dampening
low abrasion
Melting point 3600°C
Boiling point 4200 °C
Carbon fibre chips are mixed with plastics and are printed using fused deposition modelling
Glass fillers with polymers
Properties
improved tensile strength
improved compressive strength
Glass fivers cause more abrasion
Melting and boiling point depends on the polymer and glass fillers
Used in material extrusion such as fused deposition modelling
Epoxy resins
High strength
Excellent adhesion to various substances
Good electrical insulation
low cost and toxicity
Used in photo polymerization