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PACKAGING - Coggle Diagram
PACKAGING
purposes
electrical connections
aids heat dissipation
physical protection for IC
environmental protection
metrics
electrical
low capacitance
low inductance
low resistance
mechanical
reliable across T variations
thermal
low thermal resistance to get heat out
economical
purchase of the package
assembly
system
materials
plastic
low cost
custom-designed package
ceramic
better heat transfer
more reliable
package to board connections
through hole
holes drilled and plated with copper
chips placed inside holes
surface mount technology
more wiring room inside board
reduced space between packages
chips on both sides of board
soldering paste applied and heat supplied by infrared light
types of leads
gull-wing
soldering issues
j-lead
many package types available
less board space than gull-wing
solder balls
very low parasitics
BGA
LGA
types
dual in-line package
old
low performance
cheap and abundant
plastic and ceramic
zig-zag in-line package
DRAM chips
small outline package
TSOP
one of the smallest packages available
SOJ
quad-flat package
plastic leaded chip carrier
pin grid array package
ball grid array
common in high pin count chips
excellent electrical characteristics
good heat conduction
difficult to inspect once soldered
difficult to replace
system in package
high-volume small form factor products