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ENERGY DEVICES - Coggle Diagram
ENERGY DEVICES
ELECTROCHEMICAL CELL
Galvanic or Voltaic Cell
- converts enery released by a spontaneous redox reaction to electricity.
- ΔG < 0
- called voltaic cell after inventor, Italian physicist, Alessandro Volta
- anode is written on left-hand side >> oxidation occurs.
- cathode is written on right-hand side >> reduction occurs.
Daniel Cell
- invented by Britich chemist, John Frederic Daniell.
- Zn electrode dipped in ZnSO4 solution:
Oxidation: Zn → Zn^2+ + 2e-
- Cu electrode dipped in CuSO4 solution:
Reduction: Cu^2+ + 2e- → Cu
- each electrode >> half cell >> connected through salt bridge.
- salt bridge: KCl or NH4Cl in a gelatine form.
- salt bridge maintains the charge balance in the two half cells. minimizes or eliminates liquid junction potential.
- cell emf = 1.1V
EMF
- electromotive force (EMF): maximum potential difference between two electrodes of a galvanic or voltaic cell.
- related to tendency for an element, a compound or an ion to acquire (gain) or release (lose) electrons.
- cell reaction is feasible when Ecell has positive value.
- cell EMF in terms of Nernst equation:
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- a device that is used to generate electricity from a spontaneous redox reaction or, conversely, uses electricity to drive a non-spontaneous redox reaction.
- typically consists of:
- two electrodes (electronic conductors) >> anode and cathode
- an electrolyte (ionic conductor)
- metal wire (the electron conductor used to link the electrodes)
SEMICONDUCTORS
Extrinsic Semiconductor
N - Type
pentavalent impurity - P, As, Sb etc.
P - Type
trivalent impurity - B, Al, In etc.
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preparation
PURE
Distillation
- difference in boiling points.
- for Ge >> GeCl4 and for Si >> SiHCl3
Zone Refining
- difference between solubiity of impurities in the molten and solid phases is used to concentrate impurities at the end section of ingots.
- metal crystallizes while impurities remain in a molten state (mass) or melt.
- polycrystalline Ge or Si obtained.
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DOPING TECHNIQUES
Epitaxy
- unified crystal growth or deposition of a thin crystal on another substrate.
Diffusion Technique
- conversion of a region of semiconductor material by a solid or gaseous diffusion of impurity atom into the crystal lattice of the semiconductor material without any melting.