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L09 Summary - Coggle Diagram
L09 Summary
Failure Analysis
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Cause of failure
design failure
poor design -> product cannot withstand exposure to typical condition -> poor structural or material selection
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Fracture modes
translaminar failure
- fibers are broken
- 90deg to fiber
interlaminar failure
- layers have separated
- delamination
intralaminar failure
- only matrix OR fiber/matrix interface are broken
- crack
- white area/line
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Procedure
1. Collate background information
- Materials
- Laminate design
- Manufacturing method
- Service history
- Repair history
2. Visual Inspection
- provide information on fracture modes
- Suggest sub-surface damage (ultrasonic is possible but have risk, tap testing, etc)
- Damage below surface (interlaminar) can be hidden
- Use non destructive testing to identify the hidden damage
3. Non-Destructive testing
- The extent of sub-surface damage should be determined to prevent the destruction of important information during dissection
- use ultrasonic testing -> delamination can be identified
- if there is contaminants -> use couplant
4. PHOTOGRAPHY
- to keep record of failed parts before dissection
- parts must be labelled and measured (length)
- take wide shots THEN close up
5. Dissection
- water cooled cutting (not recommended)
- dry diamond rotary saw (recommended)
- chisels, wedges and lever can cause more fracture surface but can exposed delamination
- fracture surface need to be cleaned
- use light fiber or compressed air gun if the dust is obscuring the surface
->if both method does not work use, use ultrasonic bath then dry with vacuum oven
-> this method will remove chemical residue that cause the failure
-> hence this process should be done with caution
6. Verification of material and construction
- common mistake: incorrect stacking
-> used materialography to confirm the stacking sequence
- fiber perpendicular -> cutting direction is circular
- fiber parallel -> cutting direction is lines
- cutting at angle can help to identify the angle of plies (+45°, -45°)
- FTIR: identify chemical species
-> matrix type may be characterized
- DSC: measure glass transition temperature and residual heat of reaction
->determined degree of curing of matrix
- Matrix digestion and matrix ignition: remove matrix material in composition
-> determined fiber volume content
7. Optical and Electron microscope
- optical (light)
- electron (SEM)
- SEM used when high magnification(nanometer) and greater depth of field is needed
- SEM can only allow limited size of fracture
-> large fracture is harder
- SEM must be examined in high vacuum
- if material is wet / contaminated, it is harder to examine the material
-> evaporation will cause it harder to obatin high vacuum levels
- if damage is due to contaminant, do not use SEM
- non-conductive need to be coated with conductive film before examination
Fractography
- examination and interpretation of fracture surface
- provide important information on causes, location, and sequence of events leading failure
- earlier fracture can influence crack path of a later fracture
Crack path sequence
- based on top view, if delamination crack/line is continuous > delamination occurs first
- if delamination crack/line are continuous, but ply split occured in the middle > delamination occur first
- in order to see it ply split/translaminar crack occur first, delamination line will stop when it touches the ply split
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