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EXPERIMENT 6 INTRODUCTION TO OPTICAL MICROSCOPY AND ELECTRONIC MATERIALS
EXPERIMENT 6
INTRODUCTION TO OPTICAL MICROSCOPY AND ELECTRONIC MATERIALS
PART C
IDENTIFY TYPE OF ELECTRICAL CONDUCTIVITY IN AN EXTRINSIC SEMICONDUCTOR
OBJECTIVES
1)to differentiate extrinsic & extrinsic semiconductor
2) to differentiate and identify type of electrical conductivity in an extrinsic semiconductor
EQUIPMENT & TOOLS
hot or thermoelectric probe set up according to ASTM F42-77
sandpaper
two pieces of Si wafers,
PROCEDURE:
1)make sure the surface of Si wafer clean from layer of SiO2
2) removed oxide layer by polishimg the tips of probes surface using sand paper
3) make sure the connections of the probe is correct
4)he temperature of the hot probe increase in between 40-60 degree celcius and try to maintain the temperature
5) space down the probes to within a few millimeters of each other and press both down firmly on the sample.
6) observe the polarity of the digital multimeter and determine the type of conductivity of the sample tested.
PART A
INTRODUCTION TO OPTICAL MICROSCOPY AND THE USE OF OPTICAL MICROSCOPE
PART 1: MACRO STRUCTURE
(observe using naked eyes and magnifying glass)
forging block
flow pattern
why that flow pattern ?
rocks
differences between metamorphic rocks and natural rocks
concrete
elements in concrete
state the element
how many elements are there
sizes of the element
wood
belongs to isotropic type?
observe the tree rings
estimate the old of the wood
casting block
directional solidification
inclusion existed
porosity existed
wood composite
number of layer
types of layer
reason about the type of arrangement of wood composite
PART2 : MICROSTUCTURE
(observe using an optical microscope)
zink
note the etchant was used
draw the grain structure
polymer
draw the structure
state the anisotropic
bolt1 & bolt 2
observe the differences between bolt 1 and bolt 2
sketch the observation
glass
draw any structure being observed
give the comment about structure
PART B
INTRODUCTION TO ELECTRONIC MATERIALS
OBJECTIVES
1) identify function of electronic devices provided
2) identify and list down class of materials used to fabricate the electronic devices
EQUIPMENTS AND COMPONENTS
PCB with electronic devices and components
wire
magnifying glass
capacitor
optical microscope
diode
fuse
integrated circuit(IC)
light emitting diode (LED)
de-capsulated IC
resistor
transistor,
Si wafer
solder
PROCEDURE
1) choose 6 electronic devices
2)inspect the appearance of materials using naked eyes
3) sketch the appearance of device & suggest class of material that used to fabricate each part of device 4)From PCB, count how many device have similar appearance compared to early chosen & suggest possible usage of device in PCB 5) Used optical microscope to inspect B1 (de-capsulated & chip/substrate have exposed) & sketch the part have been observed 6) Suggest by giving reasons a class of materials that is used to fabricate each part of the device.