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Topic 4 Haimes sources of failure on "Optimization of solar powered…
Topic 4
Haimes sources of failure on "Optimization of solar powered water pump Project ".
Hardware failures
Constraints while designing the solar pump
Multiple designs were taken into consideration while designing the circuit.
The main hurdles were given by the requirements of the solar pump and these are difficult to restrict given the complexity of these pumps.
Weak planning
Unclear motor hardware specfication
Inadequate time spent on specifying the details of the hardware during the early project phase.
Result
Project delay
More motors were required to meet the project requirement
Increase on the overall project cost
Rapid technological changes
Solar cells
Each solar cell is only designed once
Upgrade required
Result
Obtaining the latest design of the solar cells.
Increase in cost impact.
Status monitoring
The tests could not be taken under real condition
Difficult to comprehend what the current status of the project was.
Result
Poor quality
Solution
A lot of effort on troubleshooting.
Inaccurate data collected
Software (Arduino) malfunction
Incorrect calibration
Result
Microchip burnt within the circuit
Impact
Replacement required.
Time delays
Organizational Failure
Tardiness in correcting defects
Cause of repetitive procedures.
Reduce project efficiency.
Missing valuable data due to inadequate field research
Risk of inaccurate project outcome.
Unresolved disagreements between students and lectures
Led to miscommunication
Result
Project task misguided
Delay in the delivery of the project
Ignoring minor errors to meet project deadline.
Outcome
Optimum result not achieved.
Failing to comprehend error consequences in the long run.
Ignoring long-term effects of decisions
Only short term scenarios were taken into consideration while compiling the project.
Lack of flexibility
Due to lack of resources
Limited funding
Software Failures
Technical
Arduino Software Failure
Did not use solder masking properly
Result
Within 40 secs, IC started to burn after plugging into the motherboard.
Solution
Used proper solder masking.
Ensured enough space or isolation between traces
Burnt program into IC using arduino
While uploading the chip
Result
Signature error
Solution
Used DIP version of the chip
Modified the board file
Lack of quality testing
Inadequate tests taken due to bad weather conditions
Result
Insufficient data collected
Quality of data was affected.
Development downtime
Application bug
Result
Time lost due to debugging
Loss of valuable files
Hardware (Motor) failure
Result
Time lost due to replacement of motors
Increase in project cost
Lack of periodic assessment
Failure in smartly establishing milestones
Result
Improper assessments
Human Failures
Carried out the calculation and coding with limited data.
Result
Manipulation of data
Slips of action
Confusion between two similar task
Manipulation of data.
Main task completed but finer details to the project missed.
Result
Misrepresentation of the original data.
Solution
Checklists were made in order to ensure all the tasks were completed.
Compiled the data too soon.
Misguided calculations
Result
Project delay
Poor training
Result
Derailed from original task
Delay in project due to intensive research on the task.
Lapse memory
Forgot to use solder masking on the arduino.
Result
Software device damaged.
Knowledge based mistakes
Made poor judgement when compiling
Result
Inadequate room to complete the manoeuvre the data
Restricted work space
Incorrect data
Result
Miscalculation