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PCB (Type Of PCB (Single side, Two-layer, Multi-layer, Hybrid technology …

- - - - SOT223-5
      - SOT223-4
      - SOT343
      - SOT23-5
      - SOT23-3
    - - 2512(0.25 x 0.12)
      - 2010(0.20 x 0.10)
      - 1812(0.18 x 0.12)
      - 1210(0.12 x 0.10)
      - 1206(0.12 x 0.06)
      - 0805(0.08 x 0.05)
      - 0603(0.06 x 0.03)
      - 0402(0.04 x 0.02)
      - 0201(0.02 x 0.01)
    - - CSOP(Ceramic small-outline package)
      - MSOP(Mini small-outline package)
      - PSOP(Plastic small-outline package)
      - SSOP(Shrink small-outline package)
      - TSOP(Thin small-outline package)
      - TSSOP(Thin shrink small-outline package)
      - TVSOP(Thin very-small-outline package)
      - PSON(Plastic small-outline no-lead package)
      - SOIC(Small-outline integrated circuit)
      - SOJ(Small-outline J-leaded package)
    - - QFP(Quad Flat Package)
      - CFP(Ceramic flat-pack)
      - CQFP(Ceramic QFP)
      - BQFP(Bumpered QFP)
      - QFN(Quad flat no-leads package)
      - PQFP(Plastic QFP)
      - LQFP(Low-profile QFP)
      - TQFP
      - VQFP
      - TQFN
      - VQFN
      - WQFN
      - UQFN
    - - FBGA( Fine-pitch BGA)
      - caBGA(Chip Array BGA)
      - csBGA(Chip-Scale BGA)
      - csfBGA(Chip-Scale Flip-Chip BGA)
      - fcBGA(Flip Chip BGA)
      - fpBGA(Fine Pitch BGA)
      - ftBGA(Thin BGA)
      - ucBGA(Ultra Chip-Scale BGA)
  - - - TO-226
      - TO-220
      - TO-202
      - TO-18
      - TO-8
      - TO-5
      - TO-3