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Glass soldering for bonding ceramic surfaces (advantages (chemical…
Glass soldering for bonding ceramic surfaces
advantages
chemical compatibility
viscosity
flowability
adherence
crystallization > better mechanical and corrosive properties
no damage to substrate materials
hermetically sealable joints
applications
electronics
engineering ?
specifications
substrate surface ocnditions
acid treatment
hydrofluoric
sulphuric
phosphorous
surface contact angle > does not govern the bonding strength
rapture joints
dense
interface fracture
less dense
interface fracture
less porous
glass-frit layer fracture
porous
glass-frit layer fracture
very porous
glass-frit layer fracture
bonding conditions
temperature
high > porous joint
low > dense joints
time
surface roughness > not necessarily positive