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Improve adhesion and coverage (Coating layer (%Cu (High - Low) (Thermal…
Improve adhesion and coverage
Coating layer
%Cu (High - Low)
Thermal diffusion
Induction diffusion
% Fe on the wire surface
ID (% Max)
P level
Inorganic P compound
Measure inorganic P compound equipmet
Organic P compound
Measure organic P compound equipment
Porous structure of brass layer
Scratch surface
Stranding condition
L.L.E
Ring - FS
WD condition
Lubricant properties
Cu,Zn concentration
P concentration
Fatty acid concentration
Lubricant , wire temperature
Die Pass (Slip) + wire temperature
The rubber mold condition
the increase temperature time
The actual temperature into mold