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Additive Manufacturing (Selective Laser Sintering (SLS) (How it makes…
Additive Manufacturing
Wet Process
Stereo Lithography Apparatus
(SLA)
Consists of
Vat
Photopolymer Resin
Platform
Resin Surface
Laser Beam
Laser Source
Elevator
Dry Process
Selective Laser Sintering
(SLS)
Material
Types
Nylon 12
PEEK Materials
Nylon 11
Properties
Lightweight
Highly Durable
Chemical and Heat resistant
How it makes parts
Splitting 3D CAD Data into thin or cross-section layers which is transferred into SLS additive manufacturing equipment
To create the first layer, a thin layer of powdered material is spread across the power bed by the levelling roller
CO2 laser traces the cross-section on the material, where it hits the surface to heat and fuse the material together
Once the first layer is complete, the power bed is lowered to make room for the next layer. More powder is introduced from the powder cartridge and rolled out smooth while the unused are recycled.
Repeat until complete
Consists of
Dry Process
Fused Deposition Modelling( FDM)
Consists of
How it makes parts
Thin threads like spools of thermoplastic and support materials are used to create each cross section of the part
The uncoiled material is slowly extruded through dual : heated nozzles which lay down support and thermoplastic materials upon the preceding layers.
The extrusion nozzles continues to move a horizontal X-Y plane while the build platform moves up and down, building the part layer by layer
The part is removed from the build platform and cleaned from the support materials
The parts are then surface finished
Slicing 3D Cad Data into layers which is then transferred into a machine which constructs the part later by layer on a build platform.
Materials
ABS
Prone to warping
Can withstand high heat
Tougher than PLA
Polycarbonate
Ultem
Spools of thermoplastic
Polyatic Acid(PLA)
Non toxic
Easy to print with minimum warping or curling
EBM
Part Material
Filament Style
PLA(Polyatic Acid)
Non-toxic
Easy to print with minimum warping or curling
ABS
Can withstand higher heat
Tougher than PLA
Prone to warping