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DEPOSITION (PVD (THERMAL (Comparison between Vacuum Thermal Evaporation…
DEPOSITION
CVD
diagram 
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Definition
CVD
A chemical reaction which transform gaseous molecules called precursor into solid material in the form of thin film on the surface of a substrate
PVD
Vaporization coating technique involving transfer of material from source onto substrate on atomic level
PVD
EPITACY
Def: Deposition & growth of new crystalline structure whose orientation determined by crystalline structure
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THERMAL
ELECTRON BEAM
Definition: The technique is based on the heat produced by high energy
electron beam bombardment on the material to be
deposited.
Working Principle:
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i) The electron beam is generated by an electron gun, by using the thermionic emission of electrons that produced by an incandescent filament (cathode).
iv) A magnetic field is applied to bend the electron
trajectory, so the electron gun can be placed at the below of the evaporation line.
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Diagram: 
VACUUM
Definition
Thermal Evaporation is one of the simplest of the Physical Vapor Deposition (PVD) techniques. Basically, material is heated in a vacuum chamber until its surface atoms have sufficient energy to leave the surface.
Working Principle
• Process of causing the pressure in a “liquid-filled container” to be reduced below the vapor pressure of the liquid.
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• Bulk materials are either electrically heated or subjected to electron bombardment (electron-beam) to turn to vapors.
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Diagram 
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SPUTTERING
RF sputtering
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RF sputtering Advantages
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Provide optimum coating uniformity, very flat
target erosion with no racetrack
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DC sputtering
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Definition
A target material to be used for coating is bombarded with ionized gas molecule causing atom to sputter of into the plasma with DC applied on the cathode.
Magnetron Sputtering
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The 'Glow Discharge' plasma that increase ionization of AR to the region closest to the target plate
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Comparison between RF,DC and Magnetron
Source of Power
RF
Alternating Current, 13.5 Mhz is applied.
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