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Sputtering (RF sputtering Advantages (Easier to keep plasma going under…

- - - - the –ve charge of the target is neutralized by the argon ions
        
        Ar+ ions won’t be attracted to the target anymore
        
        We need 10^12 V DC to sputter insulators
- - - - Increase the probability of ionized of sputtering gas by maintaining higher density of ions.
        
        electron or working gas attracted to the cathode then collide
        
        ejected atom can condense on the cooler substrate
        
        Process repeated until layer deposition of thin film occur
  - - - most thinnest
      - most uniform
      - most cost-effective film
- - - - electrons and ions in plasma are mobile
      - basically DC sputtering of both surfaces
    - - ions (heavy) can no longer follow the switching
      - electrons can neutralize posi0ve charge build up
- - - - Alternating Current, 13.5 Mhz is applied.
    - - Direct current
    - - RF or DC Sputtering
  - - - Conductive material
    - - Commonly used from dieletric materials
    - - uses magnet to trap target material