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Computer Processing Unit (CPU) (How a CPU is made (2.Purification and…
Computer Processing Unit (CPU)
How a CPU works
Clock
A particular wire that turns on and off at a steady rate
Measured in Gigahertz
Turn on several billion times per second, that speed will allow CPU to do complicated things very quickly.
Scott CPU
The motherboard in this CPU allows all the component to connect to each other
Allow other component to connect to each other
A lot of pins that sticking out that allow the CPU to take in information and send it back out
RAM
Consisnt of a list of addresses
short for random access memory
Address sent to RAM to begin retrieving program
RAM automatically send every pieces of data back to the CPU when the enable wire turned on
overwrite the data that received at the address with the new data
The data which in the RAM as the instruction tell the CPU to do different things
The data for sending to printer or monitor is stored in RAM
The instruction is built by the brunch of zeroes and ones
The numbers will put into RAM and then comes an end instruction to retrieve the user's guess
Instruction Set
Every CPU has its own set of instructions
LOAD
load a number from RAM to CPU
COMPARE
Compare one number with another
STORE
Store a number from the CPU back out to RAM
JUMP IF
CONDITION
Jump to another address in RAM (with condition)
ADD
Add two numbers together
JUMP
Jump to another address in RAM (without condition)
OUT
Output to a device
IN
Input from a device
ALU (Arithmetic Logic Unit)
Addition , Subtraction and Comporison
Two Inputs
Receive Type of Instruction
Operate Type of Instruction
Output to Register
How a CPU is made
1.
Sand
The microchips are made from quartz sand, which has high percentages of silicon in the form of silicon dioxide (SiO2)
2.
Purification and Growing
After procuring raw sand and separating the silicon, the excess material is disposed.
The silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon.
A huge
mono-crystal
is grown from the purified silicon melt.
3.
Ingot Slicing
The ingot is then moved onto the slicing phase where individual silicon discs, called
wafers
, are sliced thin.
4.
Photo Resist and Exposure
A photo resist liquid is poured onto the wafer while it
spins
at high speed
The silicon is spin coated with a photosensitive resist UV light transfers the circuit structure. Ultraviolet laser is shone through masks and a lens causing tiny illuminated UV lines on the surface.
5.
Wafer polishing
The soluble photo resist material is then completely dissolved by a chemical solvent.
an etch is used to partially dissolve away a tiny quantity of the polished semiconductor material.
6.
Reapplying More Photo Resist
Ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity.
7.
Ion Doping
Ion implantation, which is one form of a process called dopin, the exposed areas of the silicon wafer are bombarded with ions.
At high temperatures, the doping atoms will become flexible and take on a fixed position in the atomic structure.
8.
Electroplating the Wafer
The copper ions settle as a thin layer on the wafer surface
The wafers are put into a
copper sulphate
solution at this stage.
Copper ions
are deposited onto the transistor through a process called
electroplating.
The excess material is polished off leaving a very thin layer of copper
9.
Layering
Multiple metal layers are created to interconnects (think wires) in between the various transistors.
This multi-layer process is repeated at every single spot on the surface of the entire wafer where chips can be made. This includes even those areas which are partially off the edge of the wafer.
10.
Testing
Testing whenall of the metal layers are built up, and the circuits (transistors) are all created
Each lead completes an electrical connection within the chip, simulating how it would operate in final form once packaged into end-consumer products.
12.
Packaging
all working dies get put into a physical package
The physical packaging process involves placing the silicon die onto a green substrate material, to which tiny gold leads are connected to the chip’s pins or ball grid array, which show through the bottom side of the package.
11.
Wafer Slicing
After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces
The History of Intel Processors
Transistor-based CPU
Smaller
consumer less power
faster, more efficient
Intel X86
Intel 80186(1982)
Clockrate - 6 to 25 MHz
Memory - up to 1 MB
Feature size - 3 microns
Intel 80286(1982)
Clockrate - 6 to 25 MHz
Memory - up to 16 MB
Feature size - 1.5 microns
Intel 80386(1985)
Clockrate - 12 to 40 MHz
Memory - up to 4GB
Feature size - 1.5 microns
Intel 80486(1989)
Clockrate - 16 to 150 MHz
Memory - up to 4GB
Feature size - 1 micron
Cache - 8 to 16 kB
Vacuum Tubes
Took long time to warm up
Produced a lot of excess heat
Intel Pentium 80501(1993)
Clockrate - 60 to 66 MHz
Memory - up to 4GB
Feature size - 0.35 to 0.8 microns
Cache - 8kB instruction cache, 8kB data cache
Introduced superscalar design
supported Symmetric Dual Processig in some versions
Intel 8086 & Intel 8088(1978 & 1979)
Clockrate - 5 to 10MHz
Memory - up to 1 MB
Feature size - 3 microns
Intel Pentium Pro(1995)
Clockrate - 150 to 200 MHz
Memory - up to 64GB
Feature size - 0.35 to 0.5 microns
Cache
L1 - 8kB instrution cache, 8kB data cache
L2 - 512kB
Intel 8008(1972)
Clockrate - 0.2 to 0.8 MHz
Memory - up to 16kB
Feature size - 10 microns
Intel Pentium II
Klamath(1997)
Clockrate - 233,266 or 300 MHz
Memory - up to 64GB
Feature size - 0.35 microns
Cache
L1 -32kB
L2 - 512kB
Deschutes(1998)
Clockrate - 333MHz
Memory - up to 64GB
Feature size - 0.25 microns
Cache
L1 - 32kB
L2 - 512kB
Dixon(1999)
Clockrate - 400 MHz
Memory - up to 64 GB
Feature size - 180 nm
L1 Cache - 32 kB
L2 Cache - 256 kB on-die
Intel Pentium 3
Coppermine(2000)
Clockrate - 500 to 1133 MHz
Feature size - 180nm
L1 Cache - 16kB instruction cache & 16kB data cache
L2 Cache - 256 kB (full speed)
1.Tualatin (2001)
Clockrate - 1000 to 1400 MHz
Feature size - 130nm
L1 Cache - 16kB instruction cache & 16 kB data cache
L2 Cache - 256 kB or 512 kB(full speed)
Intel Pentium 4
1.Willamette (2000)
Clockrate - 1300 to 2000 MHz
Feature size - 180nm
L1 Cache - 20kB
L2 Cache - 256 kB
Northwood (2002)
Clockrate - 1600 to 2800 MHz
Feature size - 130nm
L2 Cache - 512kB
Prescott 2M (2005)
Clockrate - 2.8 to 4.00GHz
Feature size - 90 nm
L2 Cache - 2MB
Prescott (2004)
Clockrate - 2400 to 3067 MHz
Feature size - 90 nm
L2 Cache - 1024kB
Cedar Mill (2006)
Clockrate - 3 to 3.6 GHz
Feature size - 65 nm
L2 Cache - 2 MB
Gallatin Extreme(2003)
Clockrate -3.2 to 3.46 GHz
Feature size- 130nm
L2 Cache - 512kB
L3 Cache - 3 MB
Intel 4004(1971)
Clockrate - 740kHz
Memory - up to 4096bytes
Feature size - 10 microns
